Wire Bonding Inspection Services
Wire Bonding Inspection
Wire bonding is a very important process in wafer packaging. The accuracy of this process will determine the packaging quality of the final product. Every single unit (chip) sawed from a wafer manufactured by a semiconductor company is sent for bonding before packaging.The bonding machine picks up one chip and places it onto the substrate and then links the bond pad to its corresponding lead using the gold wire continuously. After the wire bonding process, the dam glob process is continued to protect the chip and the wire from damage.
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At EastWest SVC, we place heavy emphasis on better understanding your requirements before proposing a solution for you.
If you would like to find out more about how our Wire Bonding Inspection Services, it is best for you to consult us before making a purchasing decision for any equipment.
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Top 3 Reasons Why EastWest SVC is your trusted vendor for Wire Bonding Inspection Services
We Understand Your Needs
EastWest SVC ensures that we understand your requirements before we propose any solution to meet your needs.
More Than 10 Years of Experience
We are confident that we can offer you the best advice and consultation required to achieve your desired goals.
Trusted by leading research instituitions
EastWest SVC is honoured that the top research institutions in Singapore place their trust in us.
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Applications and Techniques
EastWest SVC distributes a wide range of products, technologies, and services for professionals. Our clients are from the industrial and manufacturing sectors such as life scientists, clinical and diagnostics researchers and process engineers. Our goal is to help you achieve the desired results using the latest technology.